NSN 5962-01-116-8676 parts are available in stock. NSN Axis allows you to search our database of more than 3 billion NSN parts from top manufacturers by their unique identification numbers. Browse the list of NSN part numbers such as DMS 8015B, ER3400, 934622E, 351-8530-020, 24351 manufactured by Dla Land And Maritime, General Semiconductor Inc, Microchip Components, Racal Communications Systems Ltd, Rockwell Collins Inc with NSN 5962-01-116-8676. We’ve listed the NSN parts such as Microcircuit Memory below that are available and ready to ship out.
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Alternative NSN: | 5962011168676 |
Manufacturers | Dla Land And Maritime , General Semiconductor Inc , Microchip Components , Racal Communications Systems Ltd , Rockwell Collins Inc , Tandem Computers Inc , Thales Uk Limited |
Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962- Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-116-8676 (011168676) |
NCB Code | USA (01) |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
DMS 8015B | dla land and maritime | microcircuit memory | Avl | RFQ |
ER3400 | general semiconductor inc | microcircuit memory | Avl | RFQ |
ER3400 | microchip components | microcircuit memory | Avl | RFQ |
934622E | racal communications systems ltd | microcircuit memory | Avl | RFQ |
351-8530-020 | rockwell collins inc | microcircuit memory | Avl | RFQ |
24351 | tandem computers inc | microcircuit memory | Avl | RFQ |
934622E | thales uk limited | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.065 INCHES MINIMUM AND 1.105 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.380 INCHES MINIMUM AND 0.393 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.125 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | RADIO SET,TYPE AN/ARC-190 |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/BUFFERED OUTPUT AND W/ENABLE AND 3-STATE OUTPUT |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.3 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 13499-351-8530 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA |
TTQY | TERMINAL TYPE AND QUANTITY | 22 PRINTED CIRCUIT |
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